IEEE T ADV PACKAGING是IEEE TRANSACTIONS ON ADVANCED PACKAGING期刊的縮寫。IEEE T ADV PACKAGING期刊的出版地是UNITED STATES，。

該刊的年文章數(shù):0，發(fā)行周期是Quarterly，從官網(wǎng)http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6040上查到本刊的通訊地址是IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141，投稿地址是http://mc.manuscriptcentral.com/tadvp-ieee。網(wǎng)友對該刊的審稿速度給與的評價是平均6月，錄用比一般是約50%。