IEEE T ELECTRON PACK是IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING期刊的縮寫。IEEE T ELECTRON PACK期刊的出版地是UNITED STATES，。

該刊的年文章數:0，發行周期是Quarterly，從官網http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6104上查到本刊的通訊地址是IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141，投稿地址是http://mc.manuscriptcentral.com/tepm-ieee。錄用比一般是容易。